Modern technological demands mean smaller packaging requirements and custom board designs. Axis Electronics advanced micro-assembly facility offers an ISO7, class 10,000 cleanroom for bare die attach, wire bonding and skilled integration processes for RF and microwave frequency products. The area is manned with a skilled and experienced team with many successful projects completed.
Building on our high technology semiconductor heritage we have more than 20 years experience in microelectronics. With proven RF capability up to 80GHz, the room is fully equipped for medium volume production runs down to 1 off prototypes.
Our manufacturing capabilities concentrate on bare die placement, wire bonding and assembly, encapsulation and integration of micro-assembled boards.