Die Bonding

Axis Electronics routinely place MMIC’s, ASIC’s, diodes, detectors and sensor bare dies using either a die robot or a manual placement process.

Our die robot, with a placement accuracy of ±25µm at rate of up to 1000 die an hour, can also accurately apply either conductive or non-conductive epoxy to a pcb or substrate, prior to pick and place. Application methods for epoxy include stamping and dispensing. Additionally the system has a time/pressure dispensing system which lends itself to encapsulation or ‘glob top’ applications (post wire bonding).

The machine has a generic work holding system, where the board is held down under vacuum. This eliminates any potential damage to a board caused by traditional work holding methods and allows a variety of substrate materials to be held for die placement; e.g. FR4, alumina, and thick & thin film boards.